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CNF NanoCourses 2004 – Section 3.7: Bonding… duration 24 minutes 58 seconds CNF NanoCourses 2004 – Section 3.7: Bonding… CNF NanoCourses 2004 – Section 3.7: Bonding and Embossing	CNF NanoCourses 2004 – Section 3.7: Bonding and Embossing semiconductor device fabrication d.n.a. introduction biotechnology microfluidic electronics matter p.m.s. dietary minerals silicon structure plastics building insulation materials solutions material molecules environmental science sensors wafer bonding electromagnetism graphic design nonmetals coatings thermodynamics semiconductor technology thermoplastics threshold temperatures hydrogen compounds arsenides substrate polymers inorganic compounds applications electrostatics separation processes materials science reducing agents semiconductor caption complete lithography hydroxides glass physics phase transitions electronics terminology mining temperature light-sensitive chemicals molecular chemistry polycarbonate commerce chemical bonding requirement fluid dynamics fluid mechanics nonpermanent polyurethanes biomolecular bonding medicine educational psychology solvents industrial processes packaging materials biology semiconductors oxidizing agents heat transfer method intermediate desiccants measuring instruments electricity chemical engineering household chemicals genetics physical chemistry concepts in physics oxides atmospheric thermodynamics glass transition dielectrics lithography (microfabrication) physiology 3play_vodcnf_standard From David Botsch 98 plays
CNF NanoCourses 2004 – Section 3.6: CMP… duration 29 minutes 26 seconds CNF NanoCourses 2004 – Section 3.6: CMP… CNF NanoCourses 2004 – Section 3.6: CMP (Daniel Woodie)	CNF NanoCourses 2004 – Section 3.6: CMP (Daniel Woodie) semiconductor device fabrication natural resources solutions cosmetics chemicals surface roughness vacuum data analysis dispositional beliefs length dietary minerals structure process mineralogy ammonium compounds sociology index food ingredients i.b.m. particle technique coatings economic geology liquids polishing microstructure native element minerals polymers phases of matter materials computer hardware companies statistical terminology materials science force film thickness metrology cryptography political philosophy oxide occupational safety and health electric and magnetic fields in matter oxoanions hydroxides stochastic processes silicon oxide phase transitions sociocultural evolution economic geography functions and mappings integrated circuits commerce electrical conductors metalworking terminology colloidal chemistry fluid dynamics biology and pharmacology of chemical elements polyurethanes cardiology pyrotechnic fuels reducing agents sociological theories solvents futurology industrial processes mechanical engineering packaging materials polish condensed matter physics human geography production and manufacturing semiconductor companies walking philosophical terminology measuring instruments dram sedimentary rocks transition metals formal methods technology mathematical analysis grinding and lapping concepts in physics oxides marketing manufacturing atmospheric thermodynamics dielectrics 3play_vodcnf_standard From David Botsch 103 plays