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CNF NanoCourses 2004 – Section 3.7: Bonding and Embossing
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David Botsch
January 20, 2012
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semiconductor device fabrication
d.n.a.
introduction
biotechnology
microfluidic
electronics
matter
p.m.s.
dietary minerals
silicon
structure
plastics
building insulation materials
solutions
material
molecules
environmental science
sensors
wafer bonding
electromagnetism
graphic design
nonmetals
coatings
thermodynamics
semiconductor technology
thermoplastics
threshold temperatures
hydrogen compounds
arsenides
substrate
polymers
inorganic compounds
+ 53 more
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